Samsung Electronics has now won the bid to produce the latest IBM Power11 server chipset, marking a crucial step forward in the Foundry segment.
Samsung is actively working on expanding its presence in the foundry segment to maintain its leading legacy. Now it has received a contract to develop the IBM Power11 chips, which will be manufactured on the enhanced 7nm (7LPP) process, helping to increase performance, save energy, and expand orders in the mature process group.
A new report from industry sources reveals that Samsung’s Foundry Division will adopt 2.5D ISC architecture packaging technology for optimizing the performance of Power11. This technology is usually used for high-end semiconductors, helping the integration of various chipsets in a single package to increase data transmission speed.
Notably, Samsung’s 7LPP process is the world’s first 7 nm process to use EUV lithography, which enables more precise and sophisticated circuit etching. It delivers 23% enhanced performance compared to the previous generation, while power consumption is reduced by up to 45%, improving operational efficiency.
The company has designed the Power11 chip with extremely high stability, maintaining data center uptime at 99.9999%, supporting system maintenance without downtime, and integrating NIST-certified quantum-resistant encryption, helping to protect the system against future encryption attacks.
Samsung’s strategy is to benefit from the gap left by TSMC’s focus on advanced processes by upgrading performance in mature processes, for instance, 5nm, 7nm, and 8nm with a production rate of 70-80%.
