Samsung’s upcoming in-house Exynos 2600 chipset is now anticipated to debut a breakthrough Heat Pass Block (HPB) packaging technology aimed at upgrading heat control and overall efficiency.
Recently, during the Q3 earnings call summit, Samsung announced that it will use its upcoming flagship Exynos 2600 initially for the next-generation Galaxy S26 series; however, it hasn’t confirmed whether the chip will power the base variants or the Ultra model also.
Now, a new report from a reliable blog, ETNews, reveals that a top Samsung official revealed that the Exynos 2600 chipset will feature its new HBP packaging technology, which is expected to promise up to 30% better heat control.
The new HPB packaging technology is reported to achieve lower operating temperatures by integrating a heat-dissipating block directly above the processor, together with a DRAM module. It will allow heat to travel more efficiently away from the main processing core, which will effectively help to maintain consistent performance even under sustained workloads such as gaming.
Regarding this new heat management system, Kim Dae-woo, SVP of Samsung’s package development team, said, “Packaging is no longer the final-stage process but the starting point of system innovation.”
If things go well as planned, then it seems that the Exynos 2600 could arrive as a major upgrade in Samsung’s Exynos lineup. The Exynos 2600 has already appeared on the Geekbench database multiple times, which revealed its impressive performance. The most recent Geekbench listing of the chip revealed that it is the Samsung processor to comes closest to the performance of the Apple M5.
-
-
-
-
