Samsung is gearing up to launch its next-generation HBM4 chipset at the ISSCC 2026 in February next year, ushering in a new revolution in the chipset market.
One of the reliable blogs, TheElec, reported that Samsung Electronics and SK Hynix are planning to introduce their HBM4 chips at the ISSCC 2026 press conference, which will be held in San Francisco, USA, from February 15th to 19th next year (local time).
According to the report, during the conference, SK Hynix explained forthcoming memory technologies, including the HBM4 memory chip. Samsung is expected to bring HBM4 integrated with 36GB capacity and a 3.3TB/s bandwidth.
This chip is highly anticipated to take over the recently launched 2.4TB/s HBM4. The company has made a few notable changes to the stacking structure and interface, which have efficiently increased the speed and efficiency. Apart from this, the Korean tech giant has developed advanced NAND flash memory technology for exploring the potential of structural changes.
Fellow Kim, a member of the ISSCC Korea Committee and a presenter in the Memory (MEM) division, explained, “We improved signal accuracy in high-speed sections by applying automatic compensation for the alignment signal (TDQS) of the channel-specific through-silicon via (TSV) path.”
It will be interesting to see how HBM4 will revolutionize the AI industry. Recently, it was also reported that Samsung is seeking to charge the same price for its HBM4 as SK Hynix in the Nvidia Deal.
