Samsung is gearing up to introduce its first-ever tri-fold (Galaxy G Fold) phone soon, which is expected to be teased next month. However, before that, a new report has leaked a few specific details about it.
Recently, the Korean tech giant has confirmed that it will host the Galaxy Unpacked event next month on July 9, in New York, at which it will debut the next-generation foldable phones, including the Galaxy Z Fold 7 & Galaxy Z Flip 7, and Galaxy Z Flip FE. Apart from these foldable phones, it’s highly expected that Samsung will also tease the Galaxy G Fold (Tri-Fold) phone at the event; however, this has not been officially confirmed yet.
Meanwhile, a tipster, @PandaFlashPro, shared a post on X, revealing a few details regarding the Tri-Fold phone. According to the post, the device will not have the Under Dispaly Camera (UDC) technology, which means the company will use the same punch-hole style.
The tipster claimed that the device will have a Titanium + Aluminium build, which makes it more durable as compared to other foldable phones. The company will use Qualcomm’s Snapdragon chipset to power the tri-fold phone, coupled with 16GB of RAM. However, the exact chipset name is unclear yet.
Samsung has not revealed a single detail regarding the specification and design of the upcoming tri-fold phone yet, so it remains to see whether the leaked details will come into existence.
