Samsung Electronics is developing a next-generation in-house Exynos 2600 chipset based on new technology, which involves inserting heat-dissipating materials into semiconductor packages, and is expected to lead to upgraded performance in next year’s Galaxy S26 smartphones.
The Korean tech giant is expected to use its flagship Exynos 2600 SoC to power the Galaxy S26, at least in a few selected regions; however, it has not officially confirmed this yet. Meanwhile, a new report suggests that the company is using a new technology for the upcoming Exynos 2600 chipset.
Reportedly, Samsung Electronics is conducting research and development to first apply the Heat Pass Block (HPB) to the ‘Exynos 2600’ based on a 2nm process, aiming to enhance the performance of the SoC.
The HPB is a copper-based heatsink, which will prevent the chip from overheating. Whereas the current Exynos chipsets have a PoP, which stands for package-on-package structure, with DRAM placed on top of the AP, the HPB is integrated on top of the AP together with the DRAM. It will help to absorb the heat coming from the AP. It’s expected that if things go as planned and the quality test of the Exynos 2600 is completed by October, then it will start mass production immediately, starting with the Galaxy S26 series.
Recently, it’s been reported that the upcoming Exynos 2600’s GPU performance surpasses the Snapdragon 8 Elite chipset, and it has also been spotted on Geekbench, revealing all ten cores.
