Exynos 2400 will get key changes to avoid previous chipset-like issues

After looking at the issues created by Exynos-based Galaxy S22 devices, Samsung completely abandoned Exynos processors from its flagship. Resultantly, we have seen all Snapdragon variants for the Galaxy S23 series. Some previous reports claimed that Samsung would again start using its Exynos chipset in the next flagship Galaxy S24. Samsung is planning an important change to the chipset to make it a huge success. 

Recently, the popular leaker Revegnus shared a Tweet on his Twitter account, according to which the South Korean firm is planning to apply FoWLP (Fan-out Water Level Packaging) to its upcoming mobile processor- Exynos 2400. If you are unaware, this package basically is a method that encloses all the integrated circuits. This package also protects the die and lets the chipset connects to the motherboard easily. 

Samsung April 2023 Security Patch fixes various Exynos flaws with over 60 vulnerabilities

Informatively, FoWLP might be a smaller package, but it will be capable of delivering a higher integration level. It also improves thermal and electrical performance. We can say that the chipset will surely be more power efficient and will no longer show issues like the previous chipset. Notably, the processor is said to be used in the next flagship, the Galaxy S24 series. It will be really interesting to see what this new chipset will offer.

However, the company still hasn’t shared any words regarding either the chipset or this new FoWLP method. So, we are suggesting you accept the information with a pinch of salt.