Samsung Electronics’ sixth-generation HBM4 chip has finally passed reliability testing with NVIDIA, and mass production will start soon.
Samsung’s HBM4 is now in the final development stage, and it’s expected that pre-production will begin by the end of this month. In case the final testing goes in favor, then full-scale mass production could start by the end of the year. A few weeks ago, it was reported that Samsung could supply HBM4 chips to NVIDIA next year.
Last month, Samsung sent its HBM4 to NVIDIA for testing, and now a new report from Sedaily exclusively revealed that the chip has successfully passed the initial ability and prototype tests. Reportedly, a key industry insider stated, “It received positive evaluations regarding quality, including yield, and has entered the PP stage for mass-production testing,” adding, “If it passes PP, mass production will be possible in November–December.”
If the yield results go in favor, then Samsung could start mass production after passing tests with NVIDIA, potentially later this year. HBM4 will be used in NVIDIA’s next-generation AI accelerator, Rubin.
On the other side, SK Hynix, currently NVIDIA’s exclusive supplier of HBM, delivered HBM4 samples in March and began supplying in early June, and then began mass production in October. Whereas Samsung Electronics will begin mass production in November, rapidly narrowing the gap with SK Hynix.
Apart from the HBM4, Samsung is also expected to start delivering its 12-layer HBM3E chips to NVIDIA soon. However, the official statement regarding this report has yet to be revealed, so it remains to be seen exactly what will happen next.
