Samsung cracked a countable deal for its HBM business, as its HBM4 chip is finalised to power Google’s next-generation Tensor Processing Units (TPUs).
It’s been so long, the Korean tech giant has been struggling to regain its leading position in the HBM market; however, now the company is gradually getting back on track. A new report from Chosun revealed that Samsung has secured a supply contract with Broadcom for the HBM4 cutting-edge memory chip.
According to the reports, Broadcom’s chairman and CEO, Hock Tan, met with Samsung executives to finalise the HBM4 supply deal. Notably, Broadcom has also requested the Kroea tech giant for a long-term supply contract until 2028.
Regarding this, an industry official stated, “CEO Hock Tan brought related executives to conclude discussions with Samsung Electronics,” adding, “Broadcom requested a supply contract until 2028, but the Samsung side only confirmed next year’s volume for now, agreeing to discuss future volumes later.”
Before confirming the deal, Broadcom examined HBM4 to ensure the memory meets the standards required for TPU. Apart from the HBM4, Samsung is also hired to supply HBM3E for TPUs. Reportedly, Google is considering using 5th-gen HBM3E for its 7th-gen TPU. while the 8th-gen model will be equipped 6th-gen HBM4.
