News
Samsung Electronics Plans To Develop 1.4nm Chips From 2027
Recently, Samsung Electronics held the “Samsung Foundry Forum 2022 Event” and showcased new foundry technology and commercial plans. Five hundred people attended the Samsung Foundry Forum this year, which was held offline for the first time in three years. These attendees included fabless clients, business partners, and partners.
On Monday, Samsung Electronics revealed a five-year plan for its contract chipmaking division, announcing that it would begin producing chips in 2025 using 2-nanometer technology and in 2027 using 1.4-nanometer technology. At the same time as process innovation, the company is accelerating the development of 2.5D/3D heterogeneous integration packaging technology.
Along with these innovations, Samsung is also working on another no less important piece, which is the heterogeneous integration of 2.5D/3D package chips. In that sense, the company has announced that the X-Cube 3D packaging technology with micro-bump interconnections “will be ready for production in volumes in 2024, while the bumpless version of the X-Cube will become available in 2026.”
All of these innovations will serve as the basis for a ‘custom and tailored’ production offering that meets customer needs, not just in-house needs. Samsung, for example, will “improve the 3nm GAA process to better support the HPC and mobile industries, further diversifying the specialized 4nm process for HPC and automotive applications.”
Speaking of the automotive sector, Samsung is currently offering market memory solutions (eNVM, embedded non-volatile memory) made at a 28 nm process. Still, it plans to provide 14 nm and 8 nm eNVM in 2024 and 2028, respectively. In addition, Samsung has mass-produced 8 nm RF solutions while working on 5 nm concepts.
To do this, Samsung is building a new Fab in Taylor, Texas, parallel upgrading the other production lines in South Korea in Giheung, Hwaseong and Pyeongtaek. At the same time, in the US, it is already present in Austin and Taylor.
During the event, Dr Si-young Choi also illustrated the ‘Shell-First’ strategy to speed up investment in production capacity. What does it consist of? In practice, Samsung decided to “build the clean rooms ahead of time, regardless of market conditions.” With clean rooms readily available, ‘manitive machinery can be installed at a later date and flexibly configured according to future demand’.
The Samsung Foundry Forum 2022, held in San Jose (United States) in the past few hours, will land in Europe (in Munich, Germany) on October 7 and then arrive in Japan (October 18) and South Korea (October 20). On those dates, perhaps, we will learn more about the company’s production technologies and specific plans for each individual region.
The Korean brand – Samsung has recently announced its two mid-range Galaxy smartphones – Galaxy A55 5G and Galaxy A35 5G. A new benchmark listing has a spot for Samsung’s affordable smartphone, Galaxy35 5G.
Samsung is now gearing up for its next affordable Galaxy smartphone, the M35 5G, as the reports are unvunveilhey have found a new benchmark listing for Samsung the Galaxy M35 5G.
The smartphone has been spotted with the model number as an identification code – SM-M356B on the Geekbench 6.2.2 database. Not only this, but it also confirmed the presence of 6GB of RAM and Android 14 OS. The chipset also came to know which is the latest Exynos 1380.
The codename for the motherboard is also mentioned, which is ‘s5e8835.’ The reports say that it has scored 656 and 1967 points in performance scores on the benchmarking platform. Exynos 1380 is the latest chipset of the Korean brand, which is a 5 nm processor. It consists of 4 Cortex A78 cores, which clock at 2.4GHz, and 4 Cortex A55 cores, which clock at 2.0GHz. It is coupled with a Mali g68 MP5 GPU. It also has an AI Engine.
This also offers connectivity options, which include the latest Bluetooth version 5.3 and Wi-Fi 802.11 ax with three bands. It supports a camera resolution of at least 200MP for capturing images, and for video recording, there is support for up to 30fps 4K recording. The storage supported is UFS v3.1, and RAM will be of the LPDDR4x/5 type.
Samsung has recently debuted its two smartphones, Galaxy A55, and Galaxy A35; the Galaxy A35 5G smartphone is powered by Exynos 1380 chipset. From this perspective, Galaxy M35 5G could be a variant of Galaxy A35.
At the moment, no specs and features of the device have been revealed or leaked. Still, since Galaxy M series smartphones usually have a bit higher battery power of at least 6000mAh, the forthcoming Galaxy M35 5G smartphone also arrives with the same battery power.
Firmware
Verizon rolls out the March 2024 security patch update for the Galaxy Z Fold 3 and Galaxy Z Flip 3 devices
Verizon has rolled out the March 2024 security patch update for the Galaxy Z Fold 3 and Galaxy Z Flip 3 devices. Earlier, these devices had received the same update outside the US, but now they are gradually expanding to the US.
The Galaxy Z Fold 3 and Galaxy Z Flip 3 are spotted getting new updates with the firmware version numbers F926USQS5HXBD and F711USQS6HXBD, respectively. It is worth noticing the update is currently available for the devices locked to Verizon, but it will soon be available on more carriers.
For your information, the latest update for Galaxy Z Fold 3 and Galaxy Z Flip 3 doesn’t bring any significant changes, but as it is the latest security patch, it will provide some internal fixes to maintain the security of the devices.
If you are getting some other issues from the last update, you should also update the device to the latest update, as it may also address some issues. Along with the update, other improvements may also be made to enhance the overall performance of the devices.
Suppose you use the Galaxy Z Fold 3 or Flip 3 device in the US. In that case, you can update the device to the latest version by simply going to the system settings and then to the software update. If you haven’t received the update, you should wait for some time, as it may arrive in the next few days.
Firmware
Samsung rolls out the March 2024 security patch update for the Galaxy S23 FE devices in the US
Samsung has rolled out the March 2024 security patch to almost all devices but still needs to complete the update distribution to all eligible devices. So, gradually expanding the update to remaining devices, the company has started rolling out the update for the Galaxy S23 FE in the US.
Notably, the Galaxy S23 FE devices are getting a new update in the carrier-unlocked version with the firmware version number S711U1UES2BXBF. The update has already been rolled out to almost all carriers, including AT&T, Bluegrass Cellular, C-Spire, Cellular South, Comcast, Cricket, DISH, MetroPCS, T-Mobile, Tracfone, US Cellular, Verizon, and Xfinity Mobile.
According to the official changelog, the March 2024 security patch is one of the standard maintenance updates that provides some internal improvements for the device, and there will be no visible changes available. In other words, users may experience some improvement in the functioning of devices, but it doesn’t particularly bring any specific changes for the device.
Going to the details, the March 2024 security patch includes more than 40 fixes, 37 of which are provided by Google and address the issues found in the Android OS, while 9 more features are introduced by Samsung that enhance the performance of Galaxy devices exclusively.
Suppose you are using the Galaxy S23 FE in the US. In that case, you can update the devices to the latest version by following the simple steps: first, go to the system settings, tap on the software update, and tap on the download and install button; if it shows a new update available, tap on the download button.