Samsung and Apple are again in the report, as Apple is asking the Korean tech giant to redesign iPhone DRAM memory to enhance AI capabilities.
According to a new report, Apple is asking one of its biggest rivals, Samsung, to redesign iPhone DRAM memory to improve AI capabilities. The Korean tech brand is considering switching to a discrete packaging method for low-power iPhone DRAM.
The report from TheElec says that Samsung is enhancing iPhone DRAM design to meet the increasing demand for memory bandwidth, powered by AI and foldable smartphones. The company’s new discrete packaging method for iPhone DRAM housed memory is dedicatedly next to the chip, upgrading heat dissipation and I/O pins, which could result in enhanced AI performance.
The new design is expected to improve AI but might not fully address low latency needs. Apart from this, Apple is also considering the next-gen LPDDR6-PIM standard for better AI performance.
AppleApple is looking forward to discrete packaging for iPhone DRAM to meet the boosted demand for high-bandwidth memory for AI tasks and generative processing, which could deliver better flexibility and allow for more I/O pins. It also reported that Apple is eying to switch iPhone LPDDR to a discrete package format starting in 2026 as it plans to separate LPDDR DRAM memory from the system semiconductor.
