Samsung is looking forward to expanding the ways to strengthen its technological competitiveness in the advanced semiconductor packaging supply chain.
A new report from ETNews suggests that the Korean tech giant should probably restructure its semiconductor packaging for the AI era. The company is checking up on its present supply chain and gearing up to form a new & impressive supply chain to stand strong as part of enhancing packaging competitiveness.
Reportedly, Samsung Electronics recently began reorganizing its advanced packaging supply chain. The aim behind this is to target equipment first, and it’s working to select equipment with ‘performance’ as its top priority from the start, regardless of existing business relationships or cooperation.
Samsung and SK are the two largest brands that supply HBM memory chips all over the world, which are crucial components for AI data centers and advanced servers. Now Samsung is working on strengthening its technology competitiveness, for which it is planning to conduct a ‘fundamental review’ of materials, parts, and equipment.
The company is planning strategic adjustments to its equipment procurement process, emphasizing performance over traditional factors, which could confuse existing industry partnerships and have an intense impact on the semiconductor market.
Regarding this, an industry insider predicted that “The entire process sector has not yet entered into a full-scale supply chain review, as it seems to be focusing on technological advancement (tech migration) such as process conversion rather than new investment, and there is not much introduction of new equipment.”
