Samsung is expanding its ways by establishing a new research lab in the United States just to focus on manufacturing three-dimensional DRAM.
A couple of months ago, Samsung unveiled that it was gearing up for the next generation of three-dimensional (3D) DRAM structures for sub-10-nanometer DRAM in October, which permits the larger single-chip capabilities that can exceed 100 GB.
Now finally, the Korean tech giant has developed a new research lab in the US, which is operating under Device Solution America (DSA), headquartered in Silicon Valley, which oversees Samsung’s semiconductor production in the US.
It is being speculated by a Yonhap news agency’s reports that the latest technology will arrive with higher-capacity memory chips of at least 100GB.
Samsung won the very first race to commercialize 3D vertical NAND flash memory chips back in 2013. In the meantime, the revenue of the global semiconductor industry declined 8.8% in 2023 due to a slowdown in enterprise as well as consumer spending. As per Counterpoint Research, AI brings fortunate reports to the semiconductor industry, emerging as a key content and revenue driver, especially in the second half of the year.
At the end, things settled down after ChatGPT of OpenAI got launched, after which several companies started investing in AI servers, which required a lot of investment. So, the price of memory chips is rising. Whereas the experts stated that 2024 will be a countable year for memory chip firms such as Samsung Electronics, Micron, and SK Hynix.
