Samsung is eagerly looking forward to securing formal orders from NVIDIA, although a few issues like yield and heat management are causing it to be late.
NVIDIA CEO Jensen Huang first publicly approved Samsung’s HBM3E modules at GTC 2024, suggesting a deal for NVIDIA orders. However, the final deal has yet to be clear since, a year later at GTC 2025, Samsung remains to secure formal orders from NVIDIA due to issues such as yield and heat management.
In the meantime, SK Hynix stands strong as a rival for Samsung as it showcases prototypes of its 12-layer HBM4 modules that will be utilized in NVIDIA’s next generation of AI accelerators. If it meets NVIDIA’s requirements for the upcoming chipset, Samsung will face competition.
During the press conference at the GTC 2025, Huang mentioned that Samsung will play an “important role” in the supply chain but didn’t reveal any particular details or decisions about orders. He didn’t even answer clearly when asked whether Samsung’s HBM3E modules will be used for the Blackwell Ultra.
However, he praised Samsung’s ability to integrate the base die of the HBM with application-specific IC and memory, which is the expertise that’s necessary for the fabrication of cutting-edge AI chips. All of this discussion has led to further speculation about whether Samsung will be able to win orders from NVIDIA or if SK Hynix will snatch the deal.
