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Samsung Seems To Use MUF In Semiconductor Packaging

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The Korean brand ‘Samsung’ is not turning the focus of its followers to molded underfill (MUF) materials in advanced semiconductor packaging. 

Samsung usually uses a non-conductive film method, but now it appears that it wants to try something new for a change, which is MUF. Basically, MUF is a technology that SK Hynix is using to manufacture its high-bandwidth memory (HBM), so with this prospect, there is a lot of curiosity about whether MUF will become a major trend. 

If the reports are to be believed, Samsung Electronics is deciding to introduce MUF materials through the through-silicon electrode (TVS) process. Actually, MUF is a material that narrows the gap between semiconductors following the TSV process of drilling thousands of micropores into the semiconductor and connecting them up and down. 

It helps various vertically stacked semiconductors in tight solidification and bonding. The reports are also revealing that recently, Samsung has bought hardening (modeling) equipment from Japan that can harden this MUF. For so long, Samsung has been using its own non-conductive adhesive film (NCF) for connecting the semiconductors vertically. NCF helps prevent chips from bending easily by placing a durable film between semiconductors. NCF was used as a key material for supporting TSV, but it was also disapproved for being difficult to handle and therefore less productive. 

With this new change, it appears that Samsung aims to improve processes and increase productivity. On the other hand, SK Hynix also used NCF till the 2nd generation HBM, but from the 3rd generation (HBM2E) straight ahead, MUF (especially mass reflow molded underfill·MR-MUF) switched to it. However, in the industry, it is considered that the main pillar of SK Hynix to stand out in the HBM market is the MUF, so by these metrics, it appears that Samsung is also adopting the MUF to develop and introduce new technologies. 

However, it is not clear yet why Samsung Electronics will apply MUF, but if it comes true, then it will be more significant. If Samsung adopts MUF after SK Hynix, then, as a result, MUF will come into view as a mainstream technology that could significantly change the market for small intestines.


Aastha is a Author of Samlover.com. With a degree in Engineering with IT, Aastha is deeply immersed in the realm of technology. Specializing in Android and Hardware. She is Passionate about technology at the service of digital entertainment that can be used through any platform. Music, movies and video games have always taken up a good part of his free time, but he doesn't give up outdoor activities, from simple walks to cycling and skiing. He has been producing editorial content for SamLover since 2022 and has run a computer and telephony store for 3 decades.

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Samsung Galaxy S25’s advanced AI novelties could boost its price

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Samsung Galaxy S24 Ultra Brightness & Adaptive Color Tone

Samsung started working on the Galaxy S25 series, which is supposed to be launched early next year. This forthcoming device is expected to be priced higher as compared to its predecessor. 

Samsung will expand its high-end S series by introducing a next-gen smartphone series named the Galaxy S25. It’s too early to discuss the Galaxy S25, but leaks and rumors are doing their jobs by offering more details about the upcoming Galaxy S25. This upcoming device is expected to cost more than the current S-series devices. 

The reason behind this report appears to be that a Galaxy S25 will be more expensive than a Galaxy S24 due to its higher manufacturing costs. The US chip designer Qualcomm could push the upcoming Snapdragon 8 Gen 4 into production in the second half of the year. This latest chipset is expected to boost AI processing. 

Snapdragon 8 Gen 4 will be a truly advanced chip, but its high-end tech advancements might lead to higher costs, which could translate into a price hike for the upcoming Galaxy S25. The report suggested that, according to a recent prediction from industry watcher Ming-Chi Kuo, Qualcomm might increase the cost of the Snapdragon 8 Gen 4 by 25–30% compared to the Gen 3 solution. 

The Snapdragon 8 Gen 4 will be manufactured on the 3nm N3E process by TSMC; it’s the same technique used to build Apple’s A18 Pro chip. This shift will supposedly cause the Snapdragon 8 Gen 4 to be 25–30% more expensive than its predecessor. Snapdragon 8 Gen 3 costs around $190–$200; by this metric, the upcoming Snapdragon 8 Gen 4 might cost $260. 

However, Samsung could deal with the higher expenses of the Snapdragon 8 Gen 4 for the Galaxy S25 by absorbing the cost or reducing the quality in other areas, such as the battery or display, but this could be risky, such as switching to its in-house Exynos 2500 chip. The upcoming chipset will be fabricated from TSMC’s most advanced process and should bring performance gains to the CPU, GPU, and NPU (AI processing).

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Firmware

Samsung Galaxy S21 series is receiving June 2024 security update in Europe 

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We are in the middle of the month, and Samsung is rolling out this month’s June 2024 security patch for Galaxy S21 smartphones in the European market. 

Samsung Galaxy S21 series, which includes three models – Galaxy S21, Galaxy S21+, and Galaxy S21 Ultra, is receiving a new June 2024 security patch in Europe. The brand has already rolled out this update for the Galaxy S21 smartphone in the US on the Verizon network. The update for the European market has arrived with its specific firmware version, as mentioned here – 

  • Galaxy S21 – G991BXXSBGXED
  • Galaxy S21+ – G996BXXSBGXED
  • Galaxy S21 Ultra – G998BXXSBGXED

Samsung’s June 2024 security update fixed all the bugs and known issues that were housed in the previous version and were creating some inconvenience while performing a few functions. Since all the bugs were fixed with the update, it will surely enhance the overall system software. 

The June 2024 security patch fixes 59 security vulnerabilities to upgrade the security and privacy of the device. It also boosts the overall system performance, security, reliability, and stability of the device to deliver a seamless and flawless performance. 

The Galaxy S21 users currently receding in Europe are eligible to download the update. Interested users can easily download the update by just following simple steps – Go to Settings >> Software Update >> Download and install.   

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Firmware

Samsung released June 2024 security patch for Galaxy Fold 5, Flip 5, Fold 4, Flip 4, Fold 3 & Flip 3 

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The Korean brand Samsung is releasing a June 2024 security patch for several Galaxy foldable devices. 

A bunch of Galaxy foldable devices include Galaxy Z Fold 5, Galaxy Z Flip 5, Galaxy Z Fold 4, Galaxy Z Flip 4, Galaxy Z Fold 3, and Galaxy Z Flip 3. All of these devices are receiving the update in the US on the Verizon network. Each of the devices getting this new update with their identification firmware version as mentioned below –

  • Galaxy Z Fold 5 – F946USQS3CXE9
  • Galaxy Z Flip 5 – F731USQS3CXE9
  • Galaxy Z Fold 4 – F936USQS5FXF1
  • Galaxy Z Flip 4 – F721USQS5FXF1
  • Galaxy Z Fold 3 – F926USQS6IXF2
  • Galaxy Z Flip 3 – F711USQS7IXF2 

Samsung has already released the June 2024 security patch for several devices. However, this update does not bring any significant upgrades or notable changes; it fixes all the bugs and known issues. The update fixes all the security vulnerabilities, which will enhance the overall security and privacy of these devices. 

The update brings approximately 60 patches to fix multiple vulnerabilities. More particularly, Google has offered 37 patches to be applied to the Android OS. This June 2024 security patch boosts the stability, reliability, and overall system software of the devices mentioned above. 

If you own any of the devices mentioned above, you can easily download this latest security patch in three steps: Go to Settings >> Software Update >> Download and install.

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