The Korean brand ‘Samsung’ is not turning the focus of its followers to molded underfill (MUF) materials in advanced semiconductor packaging.
Samsung usually uses a non-conductive film method, but now it appears that it wants to try something new for a change, which is MUF. Basically, MUF is a technology that SK Hynix is using to manufacture its high-bandwidth memory (HBM), so with this prospect, there is a lot of curiosity about whether MUF will become a major trend.
If the reports are to be believed, Samsung Electronics is deciding to introduce MUF materials through the through-silicon electrode (TVS) process. Actually, MUF is a material that narrows the gap between semiconductors following the TSV process of drilling thousands of micropores into the semiconductor and connecting them up and down.
It helps various vertically stacked semiconductors in tight solidification and bonding. The reports are also revealing that recently, Samsung has bought hardening (modeling) equipment from Japan that can harden this MUF. For so long, Samsung has been using its own non-conductive adhesive film (NCF) for connecting the semiconductors vertically. NCF helps prevent chips from bending easily by placing a durable film between semiconductors. NCF was used as a key material for supporting TSV, but it was also disapproved for being difficult to handle and therefore less productive.
With this new change, it appears that Samsung aims to improve processes and increase productivity. On the other hand, SK Hynix also used NCF till the 2nd generation HBM, but from the 3rd generation (HBM2E) straight ahead, MUF (especially mass reflow molded underfill·MR-MUF) switched to it. However, in the industry, it is considered that the main pillar of SK Hynix to stand out in the HBM market is the MUF, so by these metrics, it appears that Samsung is also adopting the MUF to develop and introduce new technologies.
However, it is not clear yet why Samsung Electronics will apply MUF, but if it comes true, then it will be more significant. If Samsung adopts MUF after SK Hynix, then, as a result, MUF will come into view as a mainstream technology that could significantly change the market for small intestines.
