Samsung Electronics is confirmed to power the next-generation flip phone next year by Exynos 2500 based on a 3nm process.
Samsung is to launch the next generation of Flip smartphones next year; Galaxy Z Flip FE and Galaxy Z Flip 7 and will be powered by an in-house Exynos 2500 chipset. However, reportedly the company for so long has struggled due to yield issues with the 3nm 2nd generation gate-all-around (GAA) process.
Finally, it seems that it has succeeded in stabilizing the 3nm manufacturing yield, and is planning to revive its mobile application processor business. Reportedly, Samsung Electronics has decided to go with Exynos 2500 to power the future Galaxy Z Flip smartphones, unlike the current Galaxy Z Flip 6 powered by Qualcomm’s Snapdragon chipset.
Samsung usually uses Qualcomm’s chipset to power its flagship devices, including foldable devices. On the other side, previously Samsung had planned to use its Exynos 2500 processor in the Galaxy S25 series, but due to low yield rates and performance issues as compared to Qualcomm’s Snapdragon series, which forced it to reconsider this plan. Now it’srumored that Samsung will power the entire Galaxy S25 series with Snapdragon 8 Elite.
