End of the hoping era! Nvidia has finally approved Samsung’s 12-layer third-generation high-bandwidth memory (HBM3E) chipset, as a new report reveals.
Samsung has been struggling hard for so long to get a 12-layer HBM3E order from Nvidia, as it will be significant for the firm to maintain its legacy. Nvidia has kept denying this order due to the heat-related issues of Samsung’s previous HBM chips. It also posed several challenging demands to Samsung to crack this deal.
Now, a new report from News1 reveals that Nvidia CEO Jensen Huang recently sent a letter of intention to buy a 12-layer HBM3E chipset to Samsung Electronics chairman Jay Y. Lee. Nvidia will use this chipset for its flagship GB300 AI accelerators.
After a long quality testing period, both companies are now coming to the final stages, in which they will decide on the quantities, pricing, and shipment schedules of the approved memory chips.
It seems that Nvidia will not demand to produce HBM3E in large quantities for the GB300, as the industry is already shifting to 6th-generation HBM4. Recently, it was reported that Nvidia requested 11 Gbps for the HBM4 chipset from Samsung.
The Korean tech giant was anticipating that this order would strengthen its position against rival SK Hynix; it remains to be seen exactly how efficient this deal will be for the firm.
