Samsung introduces its sixth-generation high-bandwidth HBM4 memory chipset based on 1c process at the SEDEX 2025 event, which could be efficient for the firm to regain its lost ground in the market.
This is quite obvious to the tech industry that Samsung has been struggling hard in the semiconductor chip market to maintain its position, as its rivals Micron and SK Hynix have already been doing well and leading the market.
Meanwhile, a new report reveals that Samsung, at the SEDEX 2025 exposition held at COEX from October 22 to 24, in Korea, unveiled its first HBM4 chipset. This newly introduced chip is efficiently made to be used in AI accelerators, which power the Generative AI algorithms used by some of the world’s largest firms.
Now, Samsung has a golden chance to regain its strong position in the market in case Nvidia decides to buy its HBM4 chips, which could potentially earn billions of dollars in operating profit every quarter for the next few years.
Samsung used a 10nm class and sixth-generation (1c) DRAM process to develop its HBM4 chip. Noticeably, this process is considered more advanced than the 10nm class, fifth-generation (1b) process used by SK Hynix for its HBM4 chips. It will be interesting to see exactly how efficient this newly launched HBM4 chipset will be for Samsung.
