Samsung seems ready to enter Broadcom’s supply chain, as it has successfully obtained great results in Broadcom’s HBM3E quality test, prototype qualification test, and completed the pre-mass production evaluation.
The Korean tech firm Samsung has completed Broadcom’s HBM3E quality test, which will efficiently help it to stand strong against its rivals, such as SK Hynix. The demand for high-performance computing (HPC) and cutting-edge technologies such as AI and machine learning is speedily increasing, significantly raising the need for HBM chips.
To date, Samsung is struggling hard to cater to the HBM market at the scale of its rivals, like SK Hynix and Nvidia. Now the company has a golden chance to strengthen its position in the market as it has cleared Broadcom’s qualification test.
A new report from Korean media outlet, FETV, revealed that Samsung’s 8-layer HBM3E has successfully cleared Broadcom’s qualification test, marking a major progress in the competitive HBM supply chain. Reportedly, several test equipment suppliers have revealed that Samsung’s upgraded HBM chip design has clearly passed all pre-mass production evaluations.
If the report comes into existence, then it will be a great achievement for the firm, since it has been struggling with issues like power efficiency and heat generation for so long, and global customers also gave multiple feedback regarding these issues.
However, its rival firm, SK Hynix, has already secured a large HBM order from Broadcom; it remains to see whether Samsung will strengthen its position by securing a large order.
