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Samsung’s Advanced 3D Chip Packaging Paves Way for HBM4 by 2025

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Samsung Electronics is gearing up to launch three-dimensional (3D) packaging services for high-bandwidth memory (HBM) soon. 

The Korean giant is launching a new 3D packaging technology for high-bandwidth memory (HBM) by the end of this year. This mechanism is expected to be used in the next generation of AI chips (HBM4), which will be released in 2025. At the Samsung Foundry Forum 2024 held in San Jose, California, the world’s largest memory chipmaker unveiled its next-generation chip technology roadmaps. 

It’s the initial stage for Samsung to release the 3D packaging technology for HBM chips at a public event. Presently, HBM chips are packaged mainly with 2.5D technology. It arrived nearly two weeks after Nvidia co-founder and Chief Executive Jensen Huang unveiled the new-generation architecture of its AI stage Rubin during a speech in Taiwan. HBM4 will likely be embedded in Nvidia’s new Rubin GPU model, expected to hit the market in 2026. 

The Korean giant’s latest packaging technology features HBM chips stacked vertically on top of Samsung Advanced Interconnection Technology-D. The brand is also offering a complete service based on turnkey for the 3D packaging of HBM chips. This involves integrating HBMs from their memory division with GPUs made for other brands by their foundry unit. The 3D packaging offers advantages, such as lower power consumption, faster processing, and improved signal quality. 

The Korean giant is also looking forward to debuting a unified package for AI accelerators with all the essential components by 2027. This package will also include optical elements for super-fast data transmission. As per the increasing demand for low-power, high-performance chips, HBM is all set to make up 30% of the DRAM market in 2025, up from 21% this year. 

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Aastha is a Author of Samlover.com. With a degree in Engineering with IT, Aastha is deeply immersed in the realm of technology. Specializing in Android and Hardware. She is Passionate about technology at the service of digital entertainment that can be used through any platform. Music, movies and video games have always taken up a good part of his free time, but he doesn't give up outdoor activities, from simple walks to cycling and skiing. He has been producing editorial content for SamLover since 2022 and has run a computer and telephony store for 3 decades.

Samsung

Samsung Officially Confirms Launch Date for Galaxy Z Fold 6, Flip 6, Watch 7, Ultra, and Buds3

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Finally, Samsung confirmed the final date of the next Galaxy Unpacked event on July 10 in Paris. Let’s take a closer look at the details of the event. 

We have already reported the teased Galaxy Unpacked event date, and the report has come true. Samsung is all set to hold one of its biggest events this year, the Galaxy Unpacked Event 2024. The brand is obsessed with hosting the Unpacked event in different cities and countries, and this time it has chosen Paris as the venue. 

At the event, Samsung will launch a bunch of the latest Galaxy devices, including the sixth-generation foldable phone, the Galaxy Z Fold 6, and the Galaxy Z Flip 6. The brand will also debut its ever-first smart wearable Ring and Ultra watch, named Galaxy Ring and Galaxy Watch Ultra, respectively. Apart from these, the next-generation Galaxy Buds 3 series and the Galaxy Watch 7. 

The Korean giant will host the unpacked event right before the 2024 Summer Olympics’ opening ceremony, and this will be one of the busiest unpacked events ever. The interesting part of the event, apart from the latest Galaxy products, will be its AI-powered tools. It will introduce more Galaxy AI features on the upcoming foldable devices. Samsung has already confirmed that it will bring AI-powered features to its wearable devices. 

Samsung will live stream the Galaxy Unpacked event on its website, newsroom portals, and YouTube. The event will kick off at 3 p.m. CEST (6 a.m. PDT, 9 a.m. EDT, and 6:30 p.m. IST). 

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Germany-Wide Coverage for Samsung Repair Bus by 2025

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Samsung has partnered with Likewize to expand its repair bus service to more regions across Germany. The brand is looking forward to expanding its bus service to almost every city by the end of this year. 

Five years ago, Samsung ran a “Repair Bus” service in Germany, basically a repair center on wheels. Finally, now again, the brand is bringing it back with plans for a near country-wide expansion. For more details, Samsung Repair Buses are mobile workshops fully equipped with the essential tools and spare parts to perform repairs as soon as possible at the client’s address. 

It’s a quite beneficial service that charges only a €20 premium fee; it can also deliver professional services at the client’s address, fluctuating from maintenance, support, and data backup to Galaxy phone battery and display replacements. By this time, somehow the reach of the brand’s repair bus service in Germany had been limited. Now, to expand the services, the giant is planning to stretch the availability of the Repair Bus to more German cities, which include Berlin, Munich, Düsseldorf, Frankfurt am Main, Hamburg, and Cologne. 

The Korean giant stated that repair buses will be available in the 15 largest cities of the country by the end of this year (2024), and by the end of next year (2025), the service will stretch to every city in Germany that has over 20,000 inhabitants. Interested customers can book a Samsung repair bus from the Smart Repair Service website. Apart from the €20 premium service fee, damage covered by the warranty is repaired free of charge. 

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Galaxy Watch Ultra, Buds 3 Reimagined by Ex-Mercedes Design Maestro

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Samsung is undoubtedly a diverse firm and one of the leading brands in the tech market. Now it is aggressively setting up to bring the latest and most unique designs for its next-gen smart wearable devices, named the Galaxy Buds 3 and Galaxy Ring. 

Samsung is about to launch its Galaxy Buds 3 and Galaxy Ring at the Galaxy Unpacked event on July 10th. Both of these wearable devices are expected to be bold, stylish, and sporty, unlike anything Samsung has done before, thanks to Samsung’s new design chief, Hubert H. Lee, who previously worked at Mercedes. The report on X shared by a well-reliable tipster suggests that the upcoming Galaxy Buds 3 will have an innovative, almost ‘Cyberpunk,’ look. 

Hubert H. Lee is an ex-Mercedes’ designer who joined Samsung back in December 2022. The Korean giant believes that Lee’s expertise will help bring a new look and feel to Galaxy products. The current Galaxy wearables, such as the Galaxy Buds FE and Galaxy Buds Watch 6, were not specifically innovative in design. It seems that maybe this is due to the designs being finalized before Lee joined Samsung in late 2022. 

Now it appears that Lee’s design influence will be more prominent in future Samsung products, especially wearables. The leaked renders of the upcoming Galaxy Watch Ultra suggest that it has a very different design than Samsung’s previous models combining a square form factor with a circular screen. If the reports are to be believed, the Galaxy Buds 3 and Buds 3 Pro wireless earbuds completely feature a different design than previous variants. These buds could be equipped with a “Blade Light” LED light strip that shines in certain scenarios. 

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