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Samsung plans to implement its dual chipset strategy for Galaxy Z Fold6 and Flip6

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Samsung is preparing to introduce its next-generation foldable device, the Galaxy Z Fold 6 and Galaxy Z Flip 6. However, given that the new smartphones in the Z lineup typically launch between July and August, some rumors suggest that the company might host the next Galaxy Unpacked event on July 10, 2024. Despite the date being more than three months away, numerous details have surfaced online.

According to recent reports, Samsung plans to implement its dual chipset strategy for the foldable, mirroring the Galaxy S series lineup, where some models of the Galaxy S base and Galaxy S+ devices feature Snapdragon, while in other markets, they feature Exynos.

The next foldable lineup rumoured to come with multiple chipsets; for example, the Galaxy Z Flip 6’s last Geekbench listing showed that it has the Snapdragon 8 Gen 2 chip. However, this processor is already one year old, so there are fewer expectations that it could be available in the main models. However, if a rumor proves to be accurate, it could potentially be available for the FE variant of the devices.

For your information, the rumors have revealed that Samsung could introduce two new versions of the foldable devices with the brand names ‘FE’ and ‘Ultra‘, so to make the difference, it may introduce them in separate chipsets. If it provides the older chipset for the FE version, then it will be successful in cost-cutting and releasing the device at a low cost.

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