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Samsung Promo Material Leak Teases New Galaxy Foldables and Watches

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Samsung has been preparing itself to showcase its Galaxy products at the most-admired Galaxy Unpacked event behind the curtains. Though there’s some time left for the next Unpacked proceeding, several leaks and rumors have already started floating around, and that’s more than enough to make certain predictions regarding what Samsung could show off. Meanwhile, a recent leak might bring some uncertainty to all the expectations that audiences have made through the rumors. 

The next Unpacked proceedings might not unveil what the audience might be expecting; rather, Samsung has some other plans. Some recently leaked renders are enough to highlight what could be showcased by the brand. According to the information shared by reliable tipster Evan Blass, who has posted some renders of the next Galaxy devices that are probably confirmed to make their way to the next Unpacked event,. 

Some jumbled-up images consist of Galaxy Z foldables, the Watch 7 series, and the Galaxy Ring: Leaks.

However, those renders shared by Blass are jumbled up, while the images reveal the next Galaxy Z foldable series, the Z Fold6 and Flip6. It could be noticeable through the images that the next Galaxy Z foldable series might feature a much boxier design with squarish corners and flat edges. Another pair of renders could be of the Galaxy Watch 7, comprising two measurement models: one is 40mm and the second is 44mm, respectively. Plus, Samsung could even launch an Ultra variant, dubbed the Galaxy Watch 7 Ultra, but through these jumbled images, it’s rather tough to say right now. 

Another set of renders claims to be of the next Galaxy Ring, which might arrive in three finishes; however, some other reports significantly reveal that Samsung has some plans to launch its next Galaxy Ring in the US in the month of August, with pre-orders to begin just after the Galaxy Unpacked proceedings. 

In addition, it’s possible that the previously hinted Galaxy Watch FE that was rumored to be unveiled in the Unpacked event is not present in the jumbled images; thus, Samsung may have different plans to launch the Galaxy Watch FE rather than unveiling it in this Unpacked event. Alongside, the Galaxy Buds 3 and 3 Pro will also not be showcased at the event.

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Aastha is a Author of Samlover.com. With a degree in Engineering with IT, Aastha is deeply immersed in the realm of technology. Specializing in Android and Hardware. She is Passionate about technology at the service of digital entertainment that can be used through any platform. Music, movies and video games have always taken up a good part of his free time, but he doesn't give up outdoor activities, from simple walks to cycling and skiing. He has been producing editorial content for SamLover since 2022 and has run a computer and telephony store for 3 decades.

Samsung

Galaxy AI Boosts Samsung Keyboard Ahead of Gboard

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Samsung Keyboard and Gboard are made to provide more convenience while typing any content for continuing your conversation or doing more with new features that are added with time, such as GIFs, stickers, and many editing options. If we talk about the basic to medium features, both of the keyboard applications come with similar features, but if we talk about some specific feature, the Samsung keyboard takes the lead.

Galaxy AI changed the game to allow users to text more conveniently

Samsung has recently introduced two new Galaxy AI-powered features with the One UI 6.1 update for the Samsung keyboard, which include writing assist and chat assist. Going into details, the writing assistant allows you to translate the text message into the desired language and also provides guidance on style and grammar. Along with this, the feature also offers to change the tone of the message in different manners, like polite, casual, professional, etc.

Meanwhile, the Chat List offers translation of messages in real time into 13 different languages, which will make it easy to understand the message in your language.

Other features that make the Samsung keyboard much better

Clipboard management: The Samsung keyboard provides more optimized functioning, which allows users to take advantage of better continuation of working with PCs and smartphones. The clipboard is also used to copy and paste objects from one device to another.

Text shortcuts: Samsung keyboards offer to create shortcuts for frequently used phrases. This will save effort when typing repetitive text.

Better swipe typing: According to the report from several users, the swipe recognition is more accurate in certain languages.

Cursor control with space bar: The Samsung keyboard lets you move the cursor by sliding the finger on space. The main difference is that you can actually move the cursor not only in the in the left and down directions but also in the up and down directions.

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Samsung Surges Smartphone Production Amidst High Demand

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The Korean firm ‘Samsung’ is raising its mass production even beyond the expectations of its smartphone division. 

Samsung Electronics is on cloud nine for the mass production of its Galaxy devices. Somewhere, the reason behind this seems to be the strong sales of the recently launched Galaxy S24 smartphones and lower-tier models in some markets. 

The report says that Samsung asked its suppliers of cameras and other components to deliver parts for nearly 50 million phones by the end of the quarter. This hints that Samsung is ramping up production even further than the initial increase mentioned earlier. The boost arrives on the heels of a massive 22% bump in orders in the first quarter, compared to Samsung’s forecasts, for an overall 17% rise in potential sales for the brand in the first half of the year. 

The reason behind the massive boost in Samsung’s sales is the generative AI-powered tools housed in the Galaxy S24series and strong sales of lower-cost phones in growing markets such as India. According to Korean supply chain industry officials, Samsung’s upward march may be coming to an end. 

However, there is an efficient chance Samsung’s phone success could continue into the second half of the year. It is about to launch its next-generation foldable phones, the Galaxy Z Fold 6 and Galaxy Z Flip 6, which could boost the sales percentage of the firm. If both of these foldables match the expectations of fans, they could keep Samsung’s actuation going.

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Samsung’s Advanced 3D Chip Packaging Paves Way for HBM4 by 2025

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Samsung Electronics is gearing up to launch three-dimensional (3D) packaging services for high-bandwidth memory (HBM) soon. 

The Korean giant is launching a new 3D packaging technology for high-bandwidth memory (HBM) by the end of this year. This mechanism is expected to be used in the next generation of AI chips (HBM4), which will be released in 2025. At the Samsung Foundry Forum 2024 held in San Jose, California, the world’s largest memory chipmaker unveiled its next-generation chip technology roadmaps. 

It’s the initial stage for Samsung to release the 3D packaging technology for HBM chips at a public event. Presently, HBM chips are packaged mainly with 2.5D technology. It arrived nearly two weeks after Nvidia co-founder and Chief Executive Jensen Huang unveiled the new-generation architecture of its AI stage Rubin during a speech in Taiwan. HBM4 will likely be embedded in Nvidia’s new Rubin GPU model, expected to hit the market in 2026. 

The Korean giant’s latest packaging technology features HBM chips stacked vertically on top of Samsung Advanced Interconnection Technology-D. The brand is also offering a complete service based on turnkey for the 3D packaging of HBM chips. This involves integrating HBMs from their memory division with GPUs made for other brands by their foundry unit. The 3D packaging offers advantages, such as lower power consumption, faster processing, and improved signal quality. 

The Korean giant is also looking forward to debuting a unified package for AI accelerators with all the essential components by 2027. This package will also include optical elements for super-fast data transmission. As per the increasing demand for low-power, high-performance chips, HBM is all set to make up 30% of the DRAM market in 2025, up from 21% this year. 

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