Samsung is now anticipated to supply its fifth-generation HBM3E chipset to Broadcom, which will be a significant deal for the firm to gain a foothold in the high-bandwidth memory (HBM) market.
For so long, Samsung has been trying hard to maintain its leading position in the HBM market, as it has lost its biggest deal with Nvidia for its HBM3E. Now it seems that the company is coming on track by dealing with Broadcom.
A few months back, it was reported that Samsung had cleared Broadcom’s HBM3E prototype qualification test. Now, a new report from Chosun revealed that Samsung will gain over 50% of Broadcom’s HBM3E supply share in the coming months. If the report comes true, then the Korean tech giant will become the largest supplier for Broadcom. Although it could also boost Samsung’s chances of securing a deal with Nvidia sooner.
Reportedly, Samsung is already grappling to enter Nvidia’s supply chain, and the major technical reason behind this is that its HBM3E products have not met Nvidia’s thermal standards, which are nearly twice as high as Broadcom’s. Another reason is that the data transmission issues occur under high temperatures. However, a semiconductor industry insider reported that Samsung has fixed almost all major technical challenges, which seems significant to crack the deal.
Recently, it’s been reported that Samsung is closer to getting a 12-layer HBM3E chip order from Nvidia for its water-cooled servers. It will be interesting to see exactly what will happen next and how efficient this new HBM3E chip’s supply deal with Broadcom will be.
