Samsung Electronics is all set to officially announce that its 12-layer HBM3E memory has passed a key customer’s certifications, which seems a key step for the firm, as it means its new memory chips are ready to be used in high-end AI devices.
According to a new report (via), an official familiar with Samsung Electronics news said, “HBM3E qualification is in the final stages, and it will be released at the end of September.” For so long, the company was struggling hard to crack this deal.
Reportedly, Samsung Electronics has considered keeping HBM3E yields and certification status; however, with the public announcement, it has strategized to formalize the conclusion of internal verification and customer testing.
On the other side, SK Hynix dominates the HBM market; Samsung Electronics’ announcement is expected to send a message to the market that it is not behind and can crack SK Hynix’s monopoly. This successful certification of its HBM3E memory is a major win for the firm.
With the rising demand for AI, driven by brands such as OpenAI, Google, and Microsoft, high-bandwidth memory (HBM) has become an essential component. The certification will be efficient for Samsung to re-establish its leading position as a key supplier of advanced memory chips for data center GPUs, addressing the performance bottleneck caused by limited memory bandwidth.
Regarding this, another official said, “Samsung Electronics’ HBM4 speed exceeds 10 Gbps,” adding, “We can meet our customers’ requirements.” Industry insiders interpret this statement, made alongside Samsung Electronics’ HBM3E certification, as a sign of confidence in HBM4’s competitiveness. It will be interesting to see exactly what will happen next and whether this achievement will help Samsung regain its leading position in the market.
