Samsung is looking forward to expanding its HBM chip production and has already signed a contract valued at around $15 million to sell and purchase semiconductor equipment.
According to a new report, Samsung signed a contract valued at around $15 million to sell and purchase semiconductor equipment, and the key reason behind this is to expand HBM chipset production facilities at its Suzhuo plant in China.
If the report from BusinesKoera is to be believed, Samsung is looking forward to strengthening its advanced semiconductor packaging to lead the supply chain. Eying the HBM4 chipset boom will help the company focus on upgrading its packaging capabilities to secure future technological competitiveness and narrow the gap with SK Hynix.
Reportedly, Tesla asked the Korean tech giant and SK Hynix to provide HBM4 samples, which hints that the US EV maker could choose either Samsung or SK Hynix as its HBM4 supplier after testing samples, and the choice will depend on sample testing. Noticeably, the packaging also includes the technology and process for shaping semiconductor chips, and it is a key factor in this decision.
However, the Korean tech giant has already increased its investment in its Suzhou, China, facility and packaging site, hoping to enhance innovation in packaging processes and improve production efficiency. Apart from all this, the brand is also maximizing its packaging production bases in its home country.
